IEEE IEMT 2022 invites you to submit your work to the 39th IEMT 2022 that will be held in Le Meridian, Putrajaya, Malaysia. It is an international event organized by the IEEE-EPS, Malaysia Chapter, with co-sponsorship from IEEE Electronic Packaging Society (EPS). The IEMT typically attracts more than 400 attendees over the world. The last IEMT 2018 (Melaka, Malaysia) hosted 600 attendees, with 100 accepted papers and interactive presentation featured in 16 sessions. IEMT 2022 welcomes papers covering electronics packaging technology in diverse semiconductor market. This segment includes telecommunication, data center, automotive, EV, healthcare, aerospace, defense and others.
With the COVID-19 situation peaking in most parts of the world and the recovery may take longer than expected, the organizing committee has decided to postpone the IEMT 2020 conference to next year (Sept 2021).
Please refer to same webpage for further conference information and updates. We looking forward to see you next year at the conference!
Call For Paper
Key Dates
| 1. Abstract Submission Due (Extension) | : 15th Apr 2022 |
| 2. Abstract Acceptance Notification | : 1st May 2022 |
| 3. Full Paper Submission | : 15th July 2022 |
| 4. IEMT 2022 Conference | : 19th – 21st Oct 2022 |
Call For Paper
| Abstract Submission Due (Extension) | Abstract Acceptance Notification Date | Full Paper Submission Date |
| 15th Apr 2022 | 1st May 2022 | 15th July 2022 |
Scope of Papers Solicited
Abstract should include original and previously unpublished, non-confidential and non-commercial information on new developments, technology and knowledge in the areas including, but not limited to those given below.
- Advanced Packaging – 2D, 2.5D, 3.0D, Chiplets, WLCSP, FOWLP, FOPLP & HI
- Thermal/Mechanical/Electrical Simulation & Characterization
- Material & Processing
- Emerging Packaging – Opto, Medical, Nano Technology, Wearable Electronics
- Interconnections Technologies – TSV, μ-bump, hybrid bond, FC and embedded
- LED,MEM & Sensor Packaging & IoT
- IC Testing Technology
- Surface Mount Technology
- Quality, Reliability & Failure Analysis
- High-Speed, Wireless & Components
Abstract are limited to 250-750 words that describes the scope, content, and key points of your proposed paper. Additional details on how to submit abstract electronically can be found on the ECTC website under the ‘Author” tab. Abstracts must be received by March 15th, 2022. All abstracts must be submitted electronically at https://in.explara.com/submix/iemt-2022.
If you have any questions, contact:
Conference Secretariat
E-mail: [email protected]
Conference Web: https://www.2022.iemt.com.my/